Electronic components
Coplanarity Measurement of BGA tin point height
Date：2020-06-05
Source：Samsun Technology
The height and width of the BGA balls need to be strictly controlled during the manufacturing process in order to ensure the top and spacing of the balls.
BGA face scanning to produce 2D plan view
Comparison of tin ball height values
Comparison of tin ball width values
BGA 3D rendering
